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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
18-6513-10T Aries Electronics 18-6513-10T 2.7270
RFQ
ECAD 3179 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 18-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
23-0518-10H Aries Electronics 23-0518-10H 2.5452
RFQ
ECAD 2384 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 23-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 23 (1 x 23) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1107254-28 Aries Electronics 1107254-28 15.2900
RFQ
ECAD 44 0.00000000 Aries Electronics Correct-A-Chip® 1107254 Bulk Active - Through Hole - 1107254 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 28 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
48-6556-20 Aries Electronics 48-6556-20 17.5075
RFQ
ECAD 4654 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 48-6556 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.283" (7.19mm) -
48-6820-90C Aries Electronics 48-6820-90C 21.0415
RFQ
ECAD 9239 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 48-6820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
97-80C251 Aries Electronics 97-80C251 -
RFQ
ECAD 3270 0.00000000 Aries Electronics - Bulk Active - - - 97-80C2 - - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - - -
20-350001-10 Aries Electronics 20-350001-10 10.8535
RFQ
ECAD 6537 0.00000000 Aries Electronics Correct-A-Chip® 350000 Bulk Active - Through Hole - 20-3500 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected A325 EAR99 8536.69.4040 19 - - 0.050" (1.27mm) - - Tin 200.0µin (5.08µm) SOJ DIP, 0.3" (7.62mm) Row Spacing 20 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
48-6552-18 Aries Electronics 48-6552-18 169.3817
RFQ
ECAD 2263 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6552 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
22-0518-00 Aries Electronics 22-0518-00 4.2218
RFQ
ECAD 9976 0.00000000 Aries Electronics 518 Bulk Active - Surface Mount SIP Open Frame 22-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (1 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.046" (1.17mm) -
20-823-90 Aries Electronics 20-823-90 12.7300
RFQ
ECAD 796 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 20-823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
21-0508-21 Aries Electronics 21-0508-21 14.4432
RFQ
ECAD 3226 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 21-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 21 (1 x 21) Beryllium Copper - Brass 0.360" (9.14mm) -
20-8375-310C Aries Electronics 20-8375-310C 12.7829
RFQ
ECAD 4613 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 20-8375 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
44-653000-10 Aries Electronics 44-653000-10 135.7450
RFQ
ECAD 4728 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 44-6530 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
20-4508-30 Aries Electronics 20-4508-30 10.6535
RFQ
ECAD 7303 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 20-4508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
10-9503-30 Aries Electronics 10-9503-30 8.2134
RFQ
ECAD 2692 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 10-9503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
08-7950-10 Aries Electronics 08-7950-10 6.4479
RFQ
ECAD 6142 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7950 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
11-0508-21 Aries Electronics 11-0508-21 8.4437
RFQ
ECAD 6709 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 11-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 11 (1 x 11) Beryllium Copper - Brass 0.360" (9.14mm) -
14-3508-201 Aries Electronics 14-3508-201 8.1173
RFQ
ECAD 2987 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
32-6554-11 Aries Electronics 32-6554-11 23.3600
RFQ
ECAD 9028 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
08-354000-10 Aries Electronics 08-354000-10 21.7779
RFQ
ECAD 4558 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active 105°C Surface Mount - 08-3540 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected Q1424359 EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 8 Beryllium Copper 0.050" (1.27mm) Brass - -
38-1518-10H Aries Electronics 38-1518-10H 4.1410
RFQ
ECAD 3629 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 38-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 38 (2 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
28-516-11S Aries Electronics 28-516-11S 13.8244
RFQ
ECAD 5245 0.00000000 Aries Electronics 516 Bulk Active - Through Hole DIP, ZIF (ZIP) Closed Frame 28-516 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.150" (3.81mm) -
145-PGM15024-40 Aries Electronics 145-PGM15024-40 39.4818
RFQ
ECAD 9519 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 145-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
84-653000-11-RC Aries Electronics 84-653000-11-RC 163.1033
RFQ
ECAD 9033 0.00000000 Aries Electronics Correct-A-Chip® 653000 Bulk Active - Through Hole Socket Included 84-6530 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - UL94 V-0 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
32-81000-610C Aries Electronics 32-81000-610C 17.0654
RFQ
ECAD 7407 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 32-8100 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
28-3518-01 Aries Electronics 28-3518-01 13.7463
RFQ
ECAD 5801 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 28-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-351000-11-RC Aries Electronics 18-351000-11-RC 23.7248
RFQ
ECAD 9526 0.00000000 Aries Electronics Correct-A-Chip® 351000 Tube Active - Through Hole - 18-3510 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A749 EAR99 8536.69.4040 21 - - 0.026" (0.65mm) Gold - Gold 10.0µin (0.25µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
84-652000-10 Aries Electronics 84-652000-10 136.7750
RFQ
ECAD 1239 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-350002-11-RC Aries Electronics 28-350002-11-RC 24.8600
RFQ
ECAD 1226 0.00000000 Aries Electronics Correct-A-Chip® 350000 Tube Active - Through Hole - 28-3500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected A757 EAR99 8536.69.4040 14 - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) SOIC DIP, 0.3" (7.62mm) Row Spacing 28 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
09-0518-10H Aries Electronics 09-0518-10H 0.9545
RFQ
ECAD 2798 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 09-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 9 (1 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse