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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
10-7860-10 Aries Electronics 10-7860-10 9.1628
RFQ
ECAD 6130 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 10-7860 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
06-0508-21 Aries Electronics 06-0508-21 4.3228
RFQ
ECAD 8558 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 06-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 6 (1 x 6) Beryllium Copper - Brass 0.360" (9.14mm) -
10-8620-210C Aries Electronics 10-8620-210C -
RFQ
ECAD 2889 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame, Elevated 10-8620 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
21-0501-20 Aries Electronics 21-0501-20 11.5080
RFQ
ECAD 4367 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 21-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 21 (1 x 21) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
24-6621-30 Aries Electronics 24-6621-30 15.8718
RFQ
ECAD 1808 0.00000000 Aries Electronics 6621 Bulk Active -55°C ~ 105°C Through Hole, Bottom Entry; Through Board DIP, 0.6" (15.24mm) Row Spacing Closed Frame 24-6621 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
05-0518-00 Aries Electronics 05-0518-00 0.7454
RFQ
ECAD 5481 0.00000000 Aries Electronics 518 Bulk Active - Surface Mount SIP Open Frame 05-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 122 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 5 (1 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.046" (1.17mm) -
24-1518-10 Aries Electronics 24-1518-10 2.2422
RFQ
ECAD 1759 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 24-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
34-6501-21 Aries Electronics 34-6501-21 16.1856
RFQ
ECAD 7169 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 34-6501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (2 x 17) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
18-3511-11 Aries Electronics 18-3511-11 8.2133
RFQ
ECAD 4071 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 18-3511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
32-C182-20 Aries Electronics 32-C182-20 21.0250
RFQ
ECAD 7408 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 32-C182 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
37-0518-10H Aries Electronics 37-0518-10H 4.0400
RFQ
ECAD 9323 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 37-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 37 (1 x 37) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-81040-310C Aries Electronics 14-81040-310C 9.4798
RFQ
ECAD 2428 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
23-0501-31 Aries Electronics 23-0501-31 14.3736
RFQ
ECAD 2886 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 23-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 23 (1 x 23) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
40-3574-10 Aries Electronics 40-3574-10 17.8346
RFQ
ECAD 2631 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 40-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
34-7500-10 Aries Electronics 34-7500-10 14.0250
RFQ
ECAD 7456 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 34-7500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
34-3513-10T Aries Electronics 34-3513-10T 3.2522
RFQ
ECAD 9644 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 34-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 34 (2 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
2357-108-12 Aries Electronics 2357-108-12 -
RFQ
ECAD 6940 0.00000000 Aries Electronics - - Active - - - - 2357-10 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
28-0511-11 Aries Electronics 28-0511-11 21.0250
RFQ
ECAD 4005 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 28-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (1 x 28) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
40-6518-112 Aries Electronics 40-6518-112 9.2900
RFQ
ECAD 1005 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 40-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
02-0508-30 Aries Electronics 02-0508-30 0.8181
RFQ
ECAD 9510 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 02-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 2 (1 x 2) Beryllium Copper - Brass 0.500" (12.70mm) -
168-PLS17011-12 Aries Electronics 168-PLS17011-12 104.6520
RFQ
ECAD 2901 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 168-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
14-0501-31 Aries Electronics 14-0501-31 11.1444
RFQ
ECAD 5487 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 14-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
12-1518-11H Aries Electronics 12-1518-11H 2.8280
RFQ
ECAD 6393 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 12-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-3554-18 Aries Electronics 24-3554-18 89.4940
RFQ
ECAD 1773 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3554 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
04-1508-21 Aries Electronics 04-1508-21 2.9492
RFQ
ECAD 2704 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 04-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
19-0503-21 Aries Electronics 19-0503-21 13.9947
RFQ
ECAD 9292 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 19-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 19 (1 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
44-6556-21 Aries Electronics 44-6556-21 30.4986
RFQ
ECAD 9344 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 44-6556 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.283" (7.19mm) -
12-6810-90TWR Aries Electronics 12-6810-90TWR 10.2718
RFQ
ECAD 9753 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.6" (15.24mm) Row Spacing Closed Frame 12-6810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 12 (2 x 6) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
28-3551-11 Aries Electronics 28-3551-11 17.6589
RFQ
ECAD 7972 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-3552-11 Aries Electronics 32-3552-11 20.4525
RFQ
ECAD 6827 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse