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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
2289-9022-00-2401 3M 2289-9022-00-2401 -
RFQ
ECAD 8237 0.00000000 3M Textool™ Bulk Obsolete - - - - - - Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
79300-14-062 3M 79300-14-062 -
RFQ
ECAD 6717 0.00000000 3M - Bulk Obsolete - - - - - - Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
2176-9028-05-2501 3M 2176-9028-05-2501 -
RFQ
ECAD 2409 0.00000000 3M Textool™ Bulk Obsolete - - - - - - Not Applicable OBSOLETE 5 - - - - - - - - - - - - -
NTE435P20 NTE Electronics, Inc NTE435P20 0.4600
RFQ
ECAD 221 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing - Solder download ROHS3 Compliant 2368-NTE435P20 EAR99 8535.90.8040 1 - - - - - - 20 (2 x 10) - 0.100" (2.54mm) - - -
NTE435K42 NTE Electronics, Inc NTE435K42 2.1400
RFQ
ECAD 31 0.00000000 NTE Electronics, Inc - Bulk Active - - DIP, 0.6" (15.24mm) Row Spacing - Solder download RoHS non-compliant 2368-NTE435K42 EAR99 8535.90.8040 1 - - - - - - 42 (2 x 21) - 0.100" (2.54mm) - - -
NTE423 NTE Electronics, Inc NTE423 0.4600
RFQ
ECAD 2 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing - Solder download ROHS3 Compliant 2368-NTE423 EAR99 8535.90.0040 1 - - - - - - 8 (2 x 4) - - - - -
NTE435K52 NTE Electronics, Inc NTE435K52 3.4300
RFQ
ECAD 1 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole DIP, 0.698" (17.72mm) Row Spacing - Solder download RoHS non-compliant 2368-NTE435K52 EAR99 8535.90.8040 1 - - - - - - 52 (2 x 26) - 0.070" (1.78mm) - 0.142" (3.60mm) -
NTE435P6 NTE Electronics, Inc NTE435P6 0.6900
RFQ
ECAD 60 0.00000000 NTE Electronics, Inc - Bulk Active - - DIP, 0.3" (7.62mm) Row Spacing - Solder download ROHS3 Compliant 2368-NTE435P6 EAR99 8536.69.8000 1 - - - - - - 6 (2 x 3) - 0.100" (2.54mm) - - -
NTE436W14 NTE Electronics, Inc NTE436W14 2.0000
RFQ
ECAD 6426 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing - Wire Wrap download ROHS3 Compliant 2368-NTE436W14 EAR99 8535.90.8040 1 - - - - - - 14 (2 x 7) - - - 0.655" (16.63mm) -
NTE435P42 NTE Electronics, Inc NTE435P42 1.6100
RFQ
ECAD 4574 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing - Solder download RoHS non-compliant 2368-NTE435P42 EAR99 8535.90.8040 1 - - - - - - 42 (2 x 21) - 0.100" (2.54mm) - - -
214-44-318-01-670799 Mill-Max Manufacturing Corp. 214-44-318-01-670799 3.8214
RFQ
ECAD 8555 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-318-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
9-1437539-1 TE Connectivity AMP Connectors 9-1437539-1 -
RFQ
ECAD 2772 0.00000000 TE Connectivity AMP Connectors 800 Box Active -55°C ~ 105°C Through Hole DIP, 0.1" (2.54mm) Row Spacing - 1437539 Solder download ROHS3 Compliant Vendor Undefined REACH info available upon request 2266-9-1437539-1 EAR99 8536.69.4040 30 3 A Polyester UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) - - 28 (2 x 14) Copper Alloy 0.100" (2.54mm) - 0.125" (3.18mm) 10mOhm
SMPX-28LCC-N-TR Kycon, Inc. SMPX-28LCC-N-TR 0.8908
RFQ
ECAD 6473 0.00000000 Kycon, Inc. SMPX Tape & Reel (TR) Active -50°C ~ 105°C Surface Mount PLCC Closed Frame SMPX-28L Solder download RoHS Compliant 1 (Unlimited) 2092-SMPX-28LCC-N-TR EAR99 8536.69.4040 450 1 A Thermoplastic, Glass Filled - 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin - 28 (4 x 7) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 15mOhm
SMPX-44LCC-P Kycon, Inc. SMPX-44LCC-P 1.2742
RFQ
ECAD 6143 0.00000000 Kycon, Inc. SMPX Tube Active -50°C ~ 105°C Surface Mount PLCC Board Guide, Closed Frame SMPX-44L Solder download RoHS Compliant 1 (Unlimited) 2092-SMPX-44LCC-P EAR99 8536.69.4040 26 1 A Thermoplastic, Glass Filled - 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin - 44 (4 x 11) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 15mOhm
SMPX-20LCC-N Kycon, Inc. SMPX-20LCC-N 1.0305
RFQ
ECAD 4932 0.00000000 Kycon, Inc. SMPX Tube Active -50°C ~ 105°C Surface Mount PLCC Closed Frame SMPX-20L Solder download RoHS Compliant 1 (Unlimited) 2092-SMPX-20LCC-N EAR99 8536.69.4040 39 1 A Thermoplastic, Glass Filled - 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin - 20 (4 x 5) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 15mOhm
2255-929A-90-2401 3M 2255-929A-90-2401 -
RFQ
ECAD 6843 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
1017-2-0256-0B-03 3M 1017-2-0256-0B-03 72.9060
RFQ
ECAD 3301 0.00000000 3M - Bulk Active - 5
2444090-1 TE Connectivity AMP Connectors 2444090-1 -
RFQ
ECAD 2473 0.00000000 TE Connectivity AMP Connectors - Bulk Active - Through Hole SIP - Solder download 17-2444090-1 1 Thermoplastic UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 78.7µin (2.00µm) 10 Copper Alloy 0.100" (2.54mm) Copper Alloy 0.109" (2.76mm) 10mOhm
ICO-648-BGG Samtec Inc. ICO-648-BGG 30.9400
RFQ
ECAD 2641 0.00000000 Samtec Inc. ICO Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-648-BGG 1 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
APO-624-G-R Samtec Inc. APO-624-G-R 20.0400
RFQ
ECAD 8638 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-624-G-R 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICF-632-TL-I Samtec Inc. ICF-632-TL-I 6.1900
RFQ
ECAD 8996 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-632-TL-I 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
APO-628-T-R Samtec Inc. APO-628-T-R 10.4300
RFQ
ECAD 3179 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-628-T-R 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICF-640-STL-I Samtec Inc. ICF-640-STL-I 15.3100
RFQ
ECAD 6389 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-640-STL-I 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICF-324-TL-I Samtec Inc. ICF-324-TL-I 4.6500
RFQ
ECAD 6440 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-324-TL-I 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
832-AG12D-ES TE Connectivity 832-AG12D-ES 1.6100
RFQ
ECAD 468 0.00000000 TE Connectivity * Bulk Obsolete - RoHS non-compliant 2266-832-AG12D-ES EAR99 8536.69.4040 44
APO-316-G-R Samtec Inc. APO-316-G-R 14.0000
RFQ
ECAD 8088 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-316-G-R 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICO-308-ZLGT Samtec Inc. ICO-308-ZLGT 3.2452
RFQ
ECAD 8090 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-308-ZLGT 56 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
APO-628-G-R Samtec Inc. APO-628-G-R 20.6100
RFQ
ECAD 4838 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-628-G-R 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICO-628-CGG Samtec Inc. ICO-628-CGG 13.2550
RFQ
ECAD 7320 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-628-CGG 16 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-624-ZSGT-L Samtec Inc. ICA-624-ZSGT-L 6.6189
RFQ
ECAD 5904 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-624-ZSGT-L 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse