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Sockets for ICs, Transistors(23290)

Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
116-91-636-41-001000 Mill-Max Manufacturing Corp. 116-91-636-41-001000 17.5953
RFQ
 ECAD 4729 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.594" (15.09mm) 10mOhm
114-47-648-41-117000 Mill-Max Manufacturing Corp. 114-47-648-41-117000 15.2968
RFQ
 ECAD 8532 0.00000000 Mill-Max Manufacturing Corp. 114 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 114-47 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy - 10mOhm
ICO-308-ZAGT Samtec Inc. ICO-308-ZAGT 3.7541
RFQ
 ECAD 3711 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-308-ZAGT 56 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICO-632-BGG Samtec Inc. ICO-632-BGG 20.6300
RFQ
 ECAD 4956 0.00000000 Samtec Inc. ICO Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-632-BGG 1 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
2133-9283-90-2401 3M 2133-9283-90-2401 -
RFQ
 ECAD 1457 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
ICA-648-ZWTT Samtec Inc. ICA-648-ZWTT 11.7767
RFQ
 ECAD 9326 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-648-ZWTT 9 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
2-5916783-5 TE Connectivity AMP Connectors 2-5916783-5 -
RFQ
 ECAD 2436 0.00000000 TE Connectivity AMP Connectors - Tray Active - Through Hole PGA, ZIF (ZIP) Open Frame 5916783 Solder - ROHS3 Compliant 1 (Unlimited) Vendor Undefined -2-5916783-5-SI EAR99 8536.69.4040 1,350 Liquid Crystal Polymer (LCP) UL94 V-0 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 15.0µin (0.38µm) 370 (19 x 19) Copper Alloy 0.100" (2.54mm) Copper Alloy 0.093" (2.36mm) -
7100186733 3M 7100186733 138.7380
RFQ
 ECAD 1349 0.00000000 3M - Bulk Active - 19-7100186733 5
ICA-308-ZSGT Samtec Inc. ICA-308-ZSGT 2.5239
RFQ
 ECAD 5014 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-308-ZSGT 56 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
24-3551-16 Aries Electronics 24-3551-16 44.6840
RFQ
 ECAD 9039 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
20-0503-30 Aries Electronics 20-0503-30 9.2354
RFQ
 ECAD 8658 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 20-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
ICF-624-SM-I Samtec Inc. ICF-624-SM-I -
RFQ
 ECAD 1587 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-624-SM-I 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICO-316-ZNGT Samtec Inc. ICO-316-ZNGT 6.0457
RFQ
 ECAD 8582 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-316-ZNGT 28 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
14-822-90 Aries Electronics 14-822-90 8.7891
RFQ
 ECAD 7043 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
116-43-322-41-006000 Mill-Max Manufacturing Corp. 116-43-322-41-006000 14.8898
RFQ
 ECAD 2567 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.236" (5.99mm) 10mOhm
522-93-109-12-051002 Mill-Max Manufacturing Corp. 522-93-109-12-051002 -
RFQ
 ECAD 3510 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 109 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
511-13-114-13-062002 Mill-Max Manufacturing Corp. 511-13-114-13-062002 -
RFQ
 ECAD 3278 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 114 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
511-91-176-15-061003 Mill-Max Manufacturing Corp. 511-91-176-15-061003 -
RFQ
 ECAD 1315 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 176 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
78010300005 HARTING 78010300005 4.1800
RFQ
 ECAD 1 0.00000000 HARTING 3D-MID Tape & Reel (TR) Active -40°C ~ 125°C - Carrier Black - - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 1,700 - Liquid Crystal Polymer (LCP) Gold
124-83-432-41-002101 Preci-Dip 124-83-432-41-002101 5.4048
RFQ
 ECAD 5695 0.00000000 Preci-Dip 124 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 124-83 Wire Wrap - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.630" (16.00mm) 10mOhm
14-0501-20 Aries Electronics 14-0501-20 9.4355
RFQ
 ECAD 2693 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 14-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
ICA-648-ZSGT Samtec Inc. ICA-648-ZSGT 12.1989
RFQ
 ECAD 2214 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-648-ZSGT 9 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
523-93-069-11-061003 Mill-Max Manufacturing Corp. 523-93-069-11-061003 -
RFQ
 ECAD 8295 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 69 (11 x 11) - 0.100" (2.54mm) - 0.510" (12.95mm) -
APA-640-T-A Samtec Inc. APA-640-T-A 9.3700
RFQ
 ECAD 5081 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-640 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
714-43-134-31-018000 Mill-Max Manufacturing Corp. 714-43-134-31-018000 9.1900
RFQ
 ECAD 7628 0.00000000 Mill-Max Manufacturing Corp. 714 Bulk Active -55°C ~ 125°C Through Hole SIP Carrier 714-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 34 (1 x 34) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
28-6508-212 Aries Electronics 28-6508-212 23.7083
RFQ
 ECAD 2004 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 28-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
10-9513-10 Aries Electronics 10-9513-10 2.9492
RFQ
 ECAD 1977 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 10-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-6501-20 Aries Electronics 24-6501-20 7.5417
RFQ
 ECAD 1976 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 24-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.410" (10.41mm) -
ICO-318-STT Samtec Inc. ICO-318-STT 2.1588
RFQ
 ECAD 8936 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-318-STT 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICF-648-STL-O Samtec Inc. ICF-648-STL-O 17.5400
RFQ
 ECAD 5310 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-648-STL-O 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse

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AD9208BBPZ-3000

196-LFBGA Exposed Pad

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