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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Color Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
64-9508-20 Aries Electronics 64-9508-20 30.2536
RFQ
ECAD 4204 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 64-9508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
16-8500-610C Aries Electronics 16-8500-610C 10.2898
RFQ
ECAD 5698 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 16-8500 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
20-0508-30 Aries Electronics 20-0508-30 7.9638
RFQ
ECAD 1478 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 20-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Beryllium Copper - Brass 0.500" (12.70mm) -
24-651000-10 Aries Electronics 24-651000-10 32.8877
RFQ
ECAD 3712 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active - Through Hole - 24-6510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
15-0518-10H Aries Electronics 15-0518-10H 1.6312
RFQ
ECAD 5038 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 15-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 15 (1 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1106396-14 Aries Electronics 1106396-14 8.9809
RFQ
ECAD 6984 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 14 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
20-3518-11 Aries Electronics 20-3518-11 3.1108
RFQ
ECAD 1091 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 20-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-822-90TWR Aries Electronics 14-822-90TWR 8.8466
RFQ
ECAD 2665 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
36-3551-16 Aries Electronics 36-3551-16 65.7271
RFQ
ECAD 1516 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
14-3625-51 Aries Electronics 14-3625-51 14.0894
RFQ
ECAD 1738 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 14-3625 Black Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Forked 14
36-6554-11 Aries Electronics 36-6554-11 22.9886
RFQ
ECAD 3558 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 36-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
29-0508-30 Aries Electronics 29-0508-30 10.8717
RFQ
ECAD 9940 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 29-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 29 (1 x 29) Beryllium Copper - Brass 0.360" (9.14mm) -
26-1508-20 Aries Electronics 26-1508-20 9.7445
RFQ
ECAD 5105 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 26-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
24-354000-21-RC Aries Electronics 24-354000-21-RC 28.6007
RFQ
ECAD 2305 0.00000000 Aries Electronics Correct-A-Chip® 354000 Bulk Active - Surface Mount - 24-3540 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) DIP, 0.3" (7.62mm) Row Spacing SOIC 24 Beryllium Copper 0.050" (1.27mm) Brass 0.089" (2.28mm) -
20-0501-21 Aries Electronics 20-0501-21 11.7807
RFQ
ECAD 6750 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 20-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
11-0625-31 Aries Electronics 11-0625-31 6.9892
RFQ
ECAD 9837 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 11-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Solder Cup 11
44-6574-10 Aries Electronics 44-6574-10 20.1743
RFQ
ECAD 4170 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
28-3513-11 Aries Electronics 28-3513-11 8.4052
RFQ
ECAD 4887 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 28-3513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
02-0501-31 Aries Electronics 02-0501-31 -
RFQ
ECAD 6528 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 125°C Through Hole SIP - 02-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 2 (1 x 2) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
48-3570-16 Aries Electronics 48-3570-16 55.5400
RFQ
ECAD 9301 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 48-3570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 48 (2 x 24) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
02-600-10 Aries Electronics 02-600-10 -
RFQ
ECAD 7212 0.00000000 Aries Electronics 600 Bulk Active Through Hole - 02-600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header - 2 0.300" (7.62mm) Tin 200.0µin (5.08µm) Forked 2
18-0625-11 Aries Electronics 18-0625-11 9.5263
RFQ
ECAD 9929 0.00000000 Aries Electronics 0625 Bulk Active Through Hole - 18-0625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Header Strip 0.100" (2.54mm) 1 - Gold 10.0µin (0.25µm) Forked 18
04-0511-11 Aries Electronics 04-0511-11 5.7378
RFQ
ECAD 7356 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole SIP - 04-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 45 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 4 (1 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
30-3625-31 Aries Electronics 30-3625-31 15.6107
RFQ
ECAD 6600 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 30-3625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Solder Cup 30
28-505-110 Aries Electronics 28-505-110 12.8587
RFQ
ECAD 6414 0.00000000 Aries Electronics Correct-A-Chip® 505 Bulk Active - Through Hole - 28-505 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC PGA 28 - 0.050" (1.27mm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
38-0508-31 Aries Electronics 38-0508-31 24.3959
RFQ
ECAD 3461 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 38-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 38 (1 x 38) Beryllium Copper - Brass 0.500" (12.70mm) -
06-7425-10 Aries Electronics 06-7425-10 8.4052
RFQ
ECAD 8688 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 06-7425 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 6 (1 x 6) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
16-0600-20 Aries Electronics 16-0600-20 1.8559
RFQ
ECAD 4946 0.00000000 Aries Electronics 0600 Bulk Active Through Hole - 16-0600 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 SIP, SIL - Header 0.100" (2.54mm) 1 - Tin 200.0µin (5.08µm) Post 16
21-0513-10H Aries Electronics 21-0513-10H 3.8178
RFQ
ECAD 5285 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 21-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 21 (1 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
108-PLS12024-12 Aries Electronics 108-PLS12024-12 81.0250
RFQ
ECAD 9540 0.00000000 Aries Electronics PLS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 108-PLS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse