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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
24-6040-6417 | - |  |
8565 | 0.00000000 | Kester Solder | 331 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.025" (0.64mm) | 361 ~ 374°F (183 ~ 190°C) | Water Soluble | 22 AWG, 23 SWG | Leaded | ||||||
 |
4890-18G | 7.6500 | |
4609 | 0.00000000 | MG Chemicals | 4890 | Bulk | Active | Wire Solder | 4890 | 0.04 lb (18.14 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Tube, 0.63 oz (18g) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
 |
28-6040-0061 | 896.8600 | |
8151 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 28-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 20 lbs (9.07kg) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | |||||
 |
SMD291SNL250T3 | 54.9500 | |
4587 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | ||
 |
SMD2032 | 122.9500 | |
1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.016" (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||
 |
RASWLF.031 1LB | 94.8500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0311LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Lead Free | |||||||
 |
WBNCC633720 | 45.9900 | |
10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||
 |
2041005 | 150.0800 | |
7016 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 3W | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | |||||
 |
TS991SNL500T4 | 97.0900 | |
6 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | TS991S | 12 Months | Date of Manufacture | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-TS991SNL500T4 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | 4 | |||||
 |
14-7068-0062 | 90.5950 | |
1826 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | - | 14 AWG, 16 SWG | Lead Free | |||||
 |
WS991LT35T4 | 42.4400 | |
6 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-WS991LT35T4 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (34.869g) | - | 280°F (138°C) | Water Soluble | - | - | 4 | |||
 |
SSNC-T5-250G | 79.9900 | |
1865 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSNC-T | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | |||||
 |
WC6301062 | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301062 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 361°F (183°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
|
70-0403-0824 | - | |
1472 | 0.00000000 | Kester Solder | EnviroMark™ 828 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | - | |||||
 |
NC2SWLF.031 1LB | 55.7500 | |
6806 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NC2SWLF.0311LB | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | |||||
 |
SMD2SWLF.012 100G | 42.9900 | |
6 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | SMD2SWLF.012100G | EAR99 | 8311.30.3000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 3.53 oz (100g) | 0.012" (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | Lead Free | - | |||
|
275498 | 0.4200 | |
5774 | 0.00000000 | Kester Solder | - | Bulk | Active | download | 117-275498 | 1 | ||||||||||||||||||||||
 |
SMD3SWLT.047 2OZ | 24.6200 | |
11 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.0472OZ | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 2 oz (56.70g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | ||||||
 |
SSLFWS-T5-15G | 26.9900 | |
3054 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSLFWS | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSLFWS-T5-15G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | - | No-Clean, Water Soluble | - | - | 5 | ||||
 |
SSWS-T5-250G | 89.9900 | |
1 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSWS-T | 24 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSWS-T5-250G | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | - | Rosin Mildly Activated (RMA), Water Soluble | - | - | Refrigerated | 5 | ||
|
1206417 | - | |
6307 | 0.00000000 | Harimatec Inc. | Loctite® C 511 | Bulk | Obsolete | Wire Solder | - | - | - | - | - | Not applicable | Not Applicable | OBSOLETE | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool | 0.048" (1.22mm) | 440°F (227°C) | Rosin Activated (RA) | - | Lead Free | - | - | ||||||
|
24-6337-8811 | - | |
4581 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.030" (0.76mm) | 361°F (183°C) | No-Clean | 21 AWG, 22 SWG | Leaded | |||||||
 |
24-7080-0027 | 78.5194 | |
3384 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7080 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Sb5 (95/5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | |||||
 |
SMD291SNL10T4 | 29.9500 | |
5308 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 4 | |||
 |
WBRC63/3762 | 43.5000 | |
9 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | |||||||
 |
SMD2SW.015 100G | 15.4900 | |
8 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | SMD2SW.015100G | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 3.53 oz (100g) | 0.015" (0.38mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | Leaded | - | |||
 |
92-6337-6420 | 48.2315 | |
4303 | 0.00000000 | Kester Solder | 331 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 361°F (183°C) | Water Soluble | 24 AWG, 25 SWG | Leaded | |||||
|
24-7340-0006 | 151.7081 | |
5958 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 24-7340 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Leaded | |||||
 |
4933-454G | - | |
2247 | 0.00000000 | MG Chemicals | 4933 | Spool | Obsolete | Wire Solder | 60 Months | Date of Manufacture | 65°F ~ 80°F (18°C ~ 27°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 473-1246 | EAR99 | 8311.30.6000 | 1 | Sn99.5Cu0.5 (99.5/0.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 442°F (228°C) | No-Clean | 24 AWG, 25 SWG | Lead Free | ||||||
|
1042100 | - | |
8245 | 0.00000000 | Harimatec Inc. | C511™ | Bulk | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn60Pb40 (60/40) | Spool, 5.51 lbs (2.5kg) | 0.064" (1.63mm) | 361 ~ 374°F (183 ~ 190°C) | No-Clean | 14 AWG, 16 SWG | Leaded | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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