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Solder(1714)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CQ100GE 35G | 28.9500 |  |
1 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | CQ100G | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-CQ100GE35G | EAR99 | 8311.90.0000 | 1 | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Syringe, 1.23 oz (35g), 10cc | - | 441°F (227°C) | No-Clean | - | Lead Free | 4 | ||||
 |
CQ100GE.020 1LB | 64.0300 | |
27 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | CQ100G | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-CQ100GE.0201LB | EAR99 | 8311.90.0000 | 1 | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | - | Lead Free | |||||
 |
SMD4300LTLFP250T4 | 106.8000 | |
4295 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | Lead Free | |||||
 |
CQB-AU100-20UM | 349.0000 | |
3 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | - | 12 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-CQB-AU100-20UM | EAR99 | 7108.13.7000 | 1 | Au100 (100) | Spool | 0.001" (0.02mm) | 1947°F (1064°C) | - | - | - | ||||
 |
SMDSN60BI40 | 19.9500 | |
2919 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-SMDSN60BI40 | EAR99 | 8311.30.6000 | 1 | Sn60Bi40 (60/40) | Spool | 0.031" (0.79mm) | 280°F ~ 338°F (138°C ~ 170°C) | - | - | Lead Free | ||||
|
4795740050 | 35.2798 | |
2221 | 0.00000000 | Kester Solder | - | Bulk | Active | Bar Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 117-4795740050 | 1 | - | Bar, 5 lbs (2.27kg) | - | 441°F (227°C) | - | - | Lead Free | |||||||||
|
70-4003-2111 | 0.4400 | |
7441 | 0.00000000 | Kester Solder | - | Bulk | Active | - | 117-70-4003-2111 | 1 | ||||||||||||||||||||||
|
70-5023-2210 | 0.5900 | |
7763 | 0.00000000 | Kester Solder | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | - | download | 117-70-5023-2210 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | - | Water Soluble | - | Lead Free | |||||||||
 |
JPAGSC1501P | 162.8000 | |
50 | 0.00000000 | Canfield Technologies | - | Tube | Active | Brazing Rod | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-JPAGSC1501P | 1 | 15% Ag, 80% Cu, 5% Phos | Tube, 1 lb (454g) | - | 1190/1475°F (643/802°C) | - | - | Lead Free | ||||||||
|
275498 | 0.4200 | |
5774 | 0.00000000 | Kester Solder | - | Bulk | Active | download | 117-275498 | 1 | ||||||||||||||||||||||
 |
SMD2SWLF.012 100G | 42.9900 | |
6 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | SMD2SWLF.012100G | EAR99 | 8311.30.3000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 3.53 oz (100g) | 0.012" (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | Lead Free | - | |||
 |
SMD3SWLT.047 2OZ | 24.6200 | |
11 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.0472OZ | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 2 oz (56.70g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | ||||||
 |
BARSN63PB37 | 29.7500 | |
10 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN63 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | - | 361°F (183°C) | - | - | Leaded | ||||||
 |
RC9601062PSAC | 86.3300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3844-RC9601062PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Lead Free | ||||||||
 |
RC9601031PSAC | 89.3900 | |
100 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | - | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 6 (Time on Label) | REACH Unaffected | 3844-RC9601031PSAC | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 423 ~ 424°F (217 ~ 218°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | Lead Free | ||||||
|
91-9574-7609 | - | |
4063 | 0.00000000 | Kester Solder | 275 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 8.8 oz (250g) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean | 27 AWG, 28 SWG | Lead Free | ||||||
 |
SSNC-15G | 14.7500 | |
5352 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSNC | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-SSNC-15G | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | - | - | No-Clean | - | - | 3 | ||||
 |
SMD3SW.020 1LB | 77.2300 | |
1 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | ||||
 |
WS991LT35T4 | 42.4400 | |
6 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-WS991LT35T4 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (34.869g) | - | 280°F (138°C) | Water Soluble | - | - | 4 | |||
 |
TS991SNL500T4 | 97.0900 | |
6 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | TS991S | 12 Months | Date of Manufacture | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-TS991SNL500T4 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | 4 | |||||
 |
WBNCC633720 | 45.9900 | |
10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||
 |
WC6301062 | 41.5300 | |
50 | 0.00000000 | Canfield Technologies | - | Spool | Active | Wire Solder | 24 Months | Date of Manufacture | 50°F ~ 104°F (10°C ~ 40°C) | - | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 3844-WC6301062 | 1 | Sn63Pb37 (63/37) | Spool, 1 lb (453.59g) | 0.062" (1.57mm) | 361°F (183°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||||||
 |
2041005 | 150.0800 | |
7016 | 0.00000000 | Harimatec Inc. | LOCTITE® GC 3W | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | |||||
 |
14-7068-0062 | 90.5950 | |
1826 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 14-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 423 ~ 424°F (217 ~ 218°C) | - | 14 AWG, 16 SWG | Lead Free | |||||
 |
NC2SWLF.031 1LB | 55.7500 | |
6806 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NC2SWLF.0311LB | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | |||||
|
18-7000-0062 | 1.0000 | |
5988 | 0.00000000 | Kester Solder | Solid Core Wire | Bulk | Active | Wire Solder | 18-7000 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn99 (99) | Spool, 20 lbs (9.07kg) | 0.062" (1.57mm) | - | - | 14 AWG, 16 SWG | Lead Free | |||||
 |
SSNC-T5-250G | 79.9900 | |
1865 | 0.00000000 | SRA Soldering Products | - | Bag | Active | Solder Paste | SSNC-T | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | |||||
|
70-0403-0824 | - | |
1472 | 0.00000000 | Kester Solder | EnviroMark™ 828 | Bulk | Obsolete | Solder Paste | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | Lead Free | - | |||||
 |
28-6040-0061 | 896.8600 | |
8151 | 0.00000000 | Kester Solder | 44 | Bulk | Active | Wire Solder | 28-6040 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 20 lbs (9.07kg) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | Leaded | |||||
 |
SMD291SNL250T3 | 54.9500 | |
4587 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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